FPC Capability：

*Max. Panel Size : 9.84"x 15.75" (250 mm x 400 mm)

*Min. Wire Width/Space : 3/3 mil (S/S) ; 3/3 mil (D/S)

*Min. Thickness of Cu : 1/3 oz

*Layer to Layer Registration : ±4 mil (0.1 mm)

*Min. Via Pad : 20 mil (0.5 mm)

*Min. Drilling Hole: 6 mil (0.15 mm)

*Multi-layers : 4 layers and above

*Base Material : PI

*Surface Finish : Hard(Soft) Gold / Immersion Gold / Tin plating / OSP

*Coverlayer : PI , Ink , LPSM

*Shielding Material : Silver Paste ,Silver Film

*Stiffener: PI, PET , FR4 and Metal

*Passive Component :Min. 0201

*Connector :Min. Pitch 0.3 mm